Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications - Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) - Bøger - William Andrew Publishing - 9780128119785 - 11. oktober 2018
Ved uoverensstemmelse mellem cover og titel gælder titel

Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications 2. udgave

Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University)

Pris
Ft 122.212

Bestilles fra fjernlager

Forventes klar til forsendelse 2. - 9. jul.

Vores kunder siger:

14 dages fuld returret
Topvurdering på Trustpilot
Tilføj til din iMusic ønskeseddel

Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications 2. udgave

498 pages

Medie Bøger     Paperback Bog   (Bog med blødt omslag og limet ryg)
Udgivet 11. oktober 2018
ISBN13 9780128119785
Forlag William Andrew Publishing
Antal sider 508
Mål 151 × 229 × 24 mm   ·   675 g
Serieredaktør Licari, James J. (AvanTeco, Whittier, CA, USA)

Se alt med Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) ( f.eks. Paperback Bog og Hardcover bog )